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超薄CSP基板

超薄CSP基板/Ultra-thin CSP substrate

產(chǎn)品類別:超薄CSP基板

基本參數(shù):CSP產(chǎn)品:板厚(0.15-0.25mm)
裝配方式:鋁線Bonding
表面處理:沉鎳金(金厚:0.05um,鎳厚:5um)
阻焊要求:黑油,黑油需塞孔; NPTH不許有殘油;不許露銅;

半孔要求:半孔金屬無缺損,無偏孔,無殘油;


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CSP產(chǎn)品:板厚(0.15-0.25mm)
裝配方式:鋁線Bonding
表面處理:沉鎳金(金厚:0.05um,鎳厚:5um)
阻焊要求:黑油,黑油需塞孔; NPTH不許有殘油;不許露銅;

半孔要求:半孔金屬無缺損,無偏孔,無殘油;

Ultra-thin CSP substrate
CSP products: board thickness (0.15-0.25mm)
Assembly method: Aluminum wire bonding
Surface treatment: Shen nickel gold (gold thickness: 0.05um, nickel thickness: 5um)
Soldering resistance requirements: black oil, black oil needs to be plugged; NPTH is not allowed to have residual oil; copper is not allowed to be exposed;
Semi-hole requirements: The semi-hole metal has no defects, no deviated holes, and no residual oil;



報價:超薄CSP基板/Ultra-thin CSP substrate

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