當(dāng)前所在位置:首頁 >> 軟硬結(jié)合板 >> 超薄CSP基板
當(dāng)前所在位置:首頁 >> 軟硬結(jié)合板 >> 超薄CSP基板 >> 軟硬結(jié)合板 >> 超薄CSP基板
產(chǎn)品類別:超薄CSP基板
半孔要求:半孔金屬無缺損,無偏孔,無殘油;
立即聯(lián)系:0755-23000466
半孔要求:半孔金屬無缺損,無偏孔,無殘油;
Ultra-thin CSP substrate
CSP products: board thickness (0.15-0.25mm)
Assembly method: Aluminum wire bonding
Surface treatment: Shen nickel gold (gold thickness: 0.05um, nickel thickness: 5um)
Soldering resistance requirements: black oil, black oil needs to be plugged; NPTH is not allowed to have residual oil; copper is not allowed to be exposed;
Semi-hole requirements: The semi-hole metal has no defects, no deviated holes, and no residual oil;